FR02-Series 10mm Ultra-Thin SMT DIP Rotaries

FR02-Series 10mm Ultra-Thin SMT DIP Rotaries
100mA Logic Level; Surface Mount, Ultra-thin, Decimal and Hexadecimal

10mm Ultra-Thin SMT DIP Rotaries

Slim .150" (3.8mm) body has the lowest profile in the industry and allows close staking of PC boards. Highly visible legends and choice of screwdriver or shaft actuators with arrow position indication provide trouble-free code setting. Detent mechanism gives crisp, positive action for accurate switch setting.  

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ND-Series 8mm Process Sealed DIP Rotaries

ND-Series 8mm Process Sealed DIP Rotaries
100mA Logic Level; Process Sealed, PCB Mount, Decimal and Hexadecimal

8mm Process Sealed DIP Rotaries

Sealed construction prevents contact contamination and allows for automated soldering and washing. Highly visible legends and choice of screwdriver or shaft actuation provide trouble-free code setting. Detent mechanism designed for crisp, positive action for accurate switch setting. Bifurcated, spring-loaded contacts give unmatched logic-level reliability. Heat-tolerant resin body meets UL flammability rating of 94V-0 and maintains switch reliability through automated soldering process, including vapor-phase soldering of SMT devices. Crimped terminals ensure secure PCB mounting and prevent dislodgment during soldering. .100" terminal grid spacing between pin centers, plus 3-by-3 terminal arrangement for footprint pattern equivalent to industry standard. Gull-winged terminals for SMD ensure mechanical stability during soldering and simplify solder-joint inspection. Epoxy sealed terminals lock out flux, solvents, and other contaminants.

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ND3-Series 8mm Process Sealed SMT DIP Rotaries

ND3-Series 8mm Process Sealed SMT DIP Rotaries
100mA Logic Level; Process Sealed, Surface Mount, Decimal and Hexadecimal

8mm Process Sealed SMT DIP Rotaries

Sealed construction prevents contact contamination and allows automated soldering and washing. Highly visible legends and choice of screwdriver or shaft actuation provide trouble-free code setting. Detent mechanism designed for crisp, positive action for accurate switch setting. Bifurcated, spring-loaded contacts give unmatched logic-level reliability. Heat-tolerant resin body meets UL flammability rating of 94V-0 and maintains switch reliability through automated soldering process, including vapor-phase soldering of SMT devices. Crimped terminals ensure secure PCB mounting and prevent dislodgment during soldering. .100" terminal grid spacing between pin centers, plus 3-x-3 terminal arrangement for footprint pattern equivalent to industry standard. Gull-winged terminals for SMD ensure mechanical stability during soldering and simplify solder-joint inspection. Epoxy sealed terminals lock out flux, solvents, and other contaminants.  

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